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Green Solder Mask Double Sided PCB Mini Card Digital Sport Camera DV Mainboard

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Shenzhen Lefang Electronics Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissCyan Hong
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Green Solder Mask Double Sided PCB Mini Card Digital Sport Camera DV Mainboard

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Brand Name :LEFANG
Model Number :RM0002L097
Certification :ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Place of Origin :Shenzhen,China
MOQ :1 Piece
Price :Negotiable
Payment Terms :T/T, Western Union, Paypal, MoneyGram
Supply Ability :290, 000 sqm Per Month
Delivery Time :2-10 work days
Packaging Details :Inner: Vacuum Packing; Dry Packing out Packing
Raw material :Fr - 4
Layer count :2 Layers
Board thickness :1.2 mm
Copper thickness :1 Oz / 35 µm
Surface treatment :OSP
Solder mask :Green
Board size2104 * 105 mm4.56 * 58.83 mm :20 * 22.4 mm
Min. Aperture :0.4 mm
Line Trace Width/Space :0.25 / 0.25 mm
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Double Sided PCB Mini Card Digital Sport Camera DV Mainboard PC Board

The double sided PCB Board is made with FR4 Board material with 1 Oz / 35 µm copper thickness. Also, the board size of this Multilayer PCB Board is 20 * 22.4 mm, with green solder mask and OSP surface treatment.

Green Solder Mask Double Sided PCB Mini Card Digital Sport Camera DV Mainboard

How to get quick quotation?

Green Solder Mask Double Sided PCB Mini Card Digital Sport Camera DV Mainboard

Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc
Step 2 Also please provide us the below details for quick quotation:

Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

Material brand: SY / KB / Rogers (optional)
Material Specification:High Tg / copper based / aluminum based or others (optional)
Board thickness: 0.1 - 6.0 mm
Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )
Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin
Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc
Board size and quantity

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

SAMPLE:

Board Basic Info - SAMPLE

Board material

Fr - 4

Material brand

KB

Material Specification

Tg 170

Board thickness

1.6 mm

Copper thickness

1 Oz

Surface Treatment

ENIG

Solder mask / sSilk print

Green / White

Board size

100 mm * 100 mm

Quantity

10k

Technical Data
Green Solder Mask Double Sided PCB Mini Card Digital Sport Camera DV Mainboard
Item Details
Max layer count 20 L
Max board thickness 6.0 mm
Max aspect ratio 10 : 1
Max copper thickness 6 OZ
Max dimension 600 * 700mm
Min thickness of 4 layers PCB 0.4 mm
Min hole / pad 0.15 / 0.35mm
Hole location accuracy + / - 0.05mm
PTH hole tolerance + / - 0.05mm
Min line width and line space 0.065 / 0.065mm

Surface treatment

HASL / HASL lead free, OSP

Immersion gold/silver/tin, gold plating (hard gold and soft gold),

silver plating, tin plating, platinum plating, carbon ink,

ENEPIG

(electroless nickel - electroless palladium - immersion gold)

Lead Time

Green Solder Mask Double Sided PCB Mini Card Digital Sport Camera DV Mainboard
Layer count Sample lead time/workday Batch lead time/workday
1-2L 2 6
4L 5 8
6L 5 9
8L 6 10
10L 8 10
12L 8 12
14L 10 15
16L 10 18
18-40L (Up to difficulty) at least 18 at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays


What kinds of quality Raw Materials will be used?
Green Solder Mask Double Sided PCB Mini Card Digital Sport Camera DV Mainboard

Board Brand ITEQ, SY, Isola. Rogers, Arlon, Nelco, Taconic, Hitachi, KB,etc
Potion Rohm & Haas, Atotech, Umicore
Printing Ink Taiyo, Rongda
Dry Film Asahi, Dupont, Etertec

Now send us your inquiry, and you will be replied within 8 hours!

Little knowledge - Double Sided PCB
Double Sided PCBs also known as Double-Sided Plated Thru or DSPT, which are the gateway to higher technology applications compared to single sided PCB.
Double Sided PCB allow for the routing of traces around each other by jumping between a top and bottom layer by way of vias.
The ability to cross paths from top to bottom greatly increasing the circuit designer's flexibility in circuits designing and lends itself to greatly increased circuit densities.

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