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OSP Surface Treatment High TG PCB Board 6 Layer RoHs UL Approved

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Shenzhen Lefang Electronics Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissCyan Hong
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OSP Surface Treatment High TG PCB Board 6 Layer RoHs UL Approved

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Brand Name :LEFANG
Model Number :RM0006L123
Certification :ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Place of Origin :Shenzhen,China
MOQ :1 Piece
Price :Negotiable
Payment Terms :T/T, Western Union, Paypal, MoneyGram
Supply Ability :290, 000 sqm Per Month
Packaging Details :Inner: Vacuum Packing; Dry Packing out Packing
Delivery Time :2-10 work days
Raw material :Fr - 4
Layer count :6 Layer
Board thickness :1.2 mm
Copper thickness :1 Oz / 35 µm
Surface treatment :OSP
Solder mask :Green
Board size2104 * 105 mm4.56 * 58.83 mm :159 * 84 mm
Min. Aperture :0.25 mm
Line Width/Space :0.1 / 0.1 mm
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RoHs UL Approved High TG PCB Board Fr4 Printed Circuit Board

The green ink high TG PCB is a double sided 6 layers printed circuit board with only 1.2 mm board thickness. While its copper thickness is 1 OZ / 35 µm, and the min. aperture is 0.25 mm and the minimum line width and space are 0.1 mil.

OSP Surface Treatment High TG PCB Board 6 Layer RoHs UL Approved

Why choose LEFANG?

OSP Surface Treatment High TG PCB Board 6 Layer RoHs UL Approved

-- Lefang provides One-Stop solution to save your cost and time.

Quick Quotation - Competitive factory price is always offered
Free Sample - Sample for free before mass production
Quality Control - Sales Team monitors the production quality and lead time
On Time Delivery - Customize the logistics plan according to customer’s requirement

After-sale Service - Reply to the claim within 24 hours to make sure our customer’s manufacturing

How to get quick quotation?

OSP Surface Treatment High TG PCB Board 6 Layer RoHs UL Approved

Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc
Step 2 Also please provide us the below details for quick quotation:

Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

Material brand: SY / KB / Rogers (optional)
Material Specification:High Tg / copper based / aluminum based or others (optional)
Board thickness: 0.1 - 6.0 mm
Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )
Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin
Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc
Board size and quantity

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

SAMPLE:

Board Basic Info - SAMPLE

Board material

Fr - 4

Material brand

KB

Material Specification

Tg 170

Board thickness

1.6 mm

Copper thickness

1 Oz

Surface Treatment

ENIG

Solder mask / sSilk print

Green / White

Board size

100 mm * 100 mm

Quantity

10k

Lead Time
OSP Surface Treatment High TG PCB Board 6 Layer RoHs UL Approved
Layer count Sample lead time/workday Batch lead time/workday
1-2L 2 6
4L 5 8
6L 5 9
8L 6 10
10L 8 10
12L 8 12
14L 10 15
16L 10 18
18-40L (Up to difficulty) at least 18 at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

What kinds of test function will be offered?

OSP Surface Treatment High TG PCB Board 6 Layer RoHs UL Approved

AOI (Automated Optical Inspection) Impedance control
Automatic short-circuit testing Metallographic microscope
RoHS detector Fly probe/ fixture mold
Dielectric tester Visual inspection


Now send us your inquiry, and you will be replied within 8 hours!

Little knowledge - High frequency PCB

The increasing complexity and rapid change of electronic components require faster signal flow rates, and thus higher transmission frequencies.

A high-frequency PCB can meet your needs when incorporating a special signal requirement into your multilayer PCBs.

It offers a frequency range of 500MHz - 2GHz, making it ideally suited for high-speed designs, as well as radio frequency (RF), microwave and mobile applications.

High frequency PCB can also provide faster signal flow rates which is of great necessity in increasingly complex electronics.

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