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Multilayer RoHS Communication PCB Circuit Board With Green Solder Mask

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Shenzhen Lefang Electronics Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissCyan Hong
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Multilayer RoHS Communication PCB Circuit Board With Green Solder Mask

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Brand Name :LEFANG
Model Number :RM0004L145
Certification :ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Place of Origin :Shenzhen,China
MOQ :1 Piece
Price :Negotiable
Payment Terms :T/T, Western Union, Paypal, MoneyGram
Supply Ability :290, 000 sqm Per Month
Packaging Details :Inner: Vacuum Packing; Dry Packing out Packing
Delivery Time :2-10 work days
Raw material :Fr - 4
Layer count :4 Layer
Board thickness :1.6 mm
Copper thickness :1 Oz / 35 µm
Surface treatment :OSP
Solder mask :Green
Board size2104 * 105 mm4.56 * 58.83 mm :65 * 40 mm
Min. Aperture :0.1 mm
Line Trace Width/Space :0.13 / 0.13 mm
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Multilayer RoHS Power Board Circuit Board PCB for Electronics Communication Main Board

The layer count multilayer PCB is 4 layers. THe board thickness is 1.6mm. And the size of this pcb board is 65 * 40 mm with white solder mask and OSP surface treatment. The min.Line Trace Width/Space are 0.13 / 0.13 mm.

Multilayer RoHS Communication PCB Circuit Board With Green Solder Mask


Why choose LEFANG?

-- Lefang provides One-Stop solution to save your cost and time.

Quick Quotation - Competitive factory price is always offered
Free Sample - Sample for free before mass production
Quality Control - Sales Team monitors the production quality and lead time
On Time Delivery - Customize the logistics plan according to customer’s requirement

After-sale Service - Reply to the claim within 24 hours to make sure our customer’s manufacturing

How to get quick quotation?

Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc
Step 2 Also please provide us the below details for quick quotation:

Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

Material brand: SY / KB / Rogers (optional)
Material Specification:High Tg / copper based / aluminum based or others (optional)
Board thickness: 0.1 - 6.0 mm
Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )
Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin
Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc
Board size and quantity

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

SAMPLE:

Board Basic Info - SAMPLE

Board material

Fr - 4

Material brand

KB

Material Specification

Tg 170

Board thickness

1.6 mm

Copper thickness

1 Oz

Surface Treatment

ENIG

Solder mask / sSilk print

Green / White

Board size

100 mm * 100 mm

Quantity

10k

Lead Time
Multilayer RoHS Communication PCB Circuit Board With Green Solder Mask
Layer count Sample lead time/workday Batch lead time/workday
1-2L 2 6
4L 5 8
6L 5 9
8L 6 10
10L 8 10
12L 8 12
14L 10 15
16L 10 18
18-40L (Up to difficulty) at least 18 at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

What kinds of quality Raw Materials will be used?

Multilayer RoHS Communication PCB Circuit Board With Green Solder Mask

Board Brand ITEQ, SY, Isola. Rogers, Arlon, Nelco, Taconic, Hitachi, KB,etc
Potion Rohm & Haas, Atotech, Umicore
Printing Ink Taiyo, Rongda
Dry Film Asahi, Dupont, Etertec

Now send us your inquiry, and you will be replied within 8 hours!

Little knowledge - Multilayer PCB Board

Multilayer printed circuit boards (Multilayer PCBs) represented the next major evolution in fabrication technology.

A very sophisticated and complex methodology came from the base platform of double sided plated.

This methodology would again allow circuit board designers a dynamic range of interconnects and applications.

Multilayer PCB board were essential in the advancement of modern computing, and their basic construction and fabrication are similar to micro chip fabrication on a micro size.

The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills, and it can be built on ceramic, copper, and aluminum. Also, blind and buried vias are commonly produced in multilayer pcb manufacturing, along with pad on via technology.

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