Shenzhen Lefang Electronics Co., Ltd

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LED Parallel Round Printed Circuit Board , LED Bulb PCB Board 6000K - 6500K

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Shenzhen Lefang Electronics Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissCyan Hong
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LED Parallel Round Printed Circuit Board , LED Bulb PCB Board 6000K - 6500K

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Brand Name :LEFANG
Model Number :OT6001L371
Certification :ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Place of Origin :Shenzhen,China
MOQ :1 Piece
Price :Negotiable
Payment Terms :T/T, Western Union, Paypal
Supply Ability :290, 000sqm Per Month
Packaging Details :Inner: Vacuum Packing; Dry Packing out Packing
Delivery Time :2-10 work days
Base Material/ Dielectric :Copper base
Layer count :1 layer single sided
Board thickness :2.0 mm
Copper thickness :2.0 mm
Solder Mask :White
surface treatment :OSP
Board Size :50 * 50 mm
Min. Aperture :0.1 mm
Line Width/Spacing :0.1 / 0.1 mm
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LED Parallel Round LED Bulb 6000K - 6500K circuit board for led light

For the copper base PCB, it usually contributes in LED lighting and other heat generated applicationS. The layer count of automotive PCB board is 1 layer and the specification is 50 * 50 mm. Also, the surface treatment of this coppere base PCB board is OSP. Its minimum aperture is 0.1 mm, with white solder mask.

How to get quick quotation?

LED Parallel Round Printed Circuit Board , LED Bulb PCB Board 6000K - 6500K

Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc
Step 2 Also please provide us the below details for quick quotation:

Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

Material brand: SY / KB / Rogers (optional)
Material Specification:High Tg / copper based / aluminum based or others (optional)
Board thickness: 0.1 - 6.0 mm
Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )
Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin
Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc
Board size and quantity

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

SAMPLE:

Board Basic Info - SAMPLE

Board material

Fr - 4

Material brand

KB

Material Specification

Tg 170

Board thickness

1.6 mm

Copper thickness

1 Oz

Surface Treatment

ENIG

Solder mask / sSilk print

Green / White

Board size

100 mm * 100 mm

Quantity

10k

Technical Data

LED Parallel Round Printed Circuit Board , LED Bulb PCB Board 6000K - 6500K
Item Details
Max layer count 20 L
Max board thickness 6.0 mm
Max aspect ratio 10 : 1
Max copper thickness 6 OZ
Max dimension 600 * 700mm
Min thickness of 4 layers PCB 0.4 mm
Min hole / pad 0.15 / 0.35mm
Hole location accuracy + / - 0.05mm
PTH hole tolerance + / - 0.05mm
Min line width and line space 0.065 / 0.065mm
Surface treatment

HASL / HASL lead free, OSP

Immersion gold/silver/tin, gold plating (hard gold and soft gold),

silver plating, tin plating, platinum plating, carbon ink,

ENEPIG

(electroless nickel - electroless palladium - immersion gold)

Lead Time
LED Parallel Round Printed Circuit Board , LED Bulb PCB Board 6000K - 6500K
Layer count Sample lead time/workday Batch lead time/workday
1-2L 2 6
4L 5 8
6L 5 9
8L 6 10
10L 8 10
12L 8 12
14L 10 15
16L 10 18
18-40L (Up to difficulty) at least 18 at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

How to guarantee our high quality products?

LED Parallel Round Printed Circuit Board , LED Bulb PCB Board 6000K - 6500K

-- We employ 70 professional engineers to ensure our high quality products.

Department Headcount
Electronic Eng. 13
R&D Eng. 15
PE Eng. 10
CAM Eng. 26
MI Eng. 6


Now send us your inquiry, and you will be replied within 8 hours!

Little knowledge - Double Sided PCB

Double Sided PCBs also known as Double-Sided Plated Thru or DSPT, which are the gateway to higher technology applications compared to single sided PCB.

Double Sided PCB allow for the routing of traces around each other by jumping between a top and bottom layer by way of vias.

The ability to cross paths from top to bottom greatly increasing the circuit designer's flexibility in circuits designing and lends itself to greatly increased circuit densities.

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