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Fr 4 Material High Frequency PCB Board Automated PCB Assembly 303 * 150 Mm

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Shenzhen Lefang Electronics Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissCyan Hong
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Fr 4 Material High Frequency PCB Board Automated PCB Assembly 303 * 150 Mm

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Brand Name :LEFANG
Model Number :RM0004L053
Certification :ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Place of Origin :Shenzhen,China
MOQ :1 Piece
Price :Negotiable
Payment Terms :T/T, Western Union, Paypal, MoneyGram
Supply Ability :290, 000 sqm Per Month
Packaging Details :Inner: Vacuum Packing; Dry Packing out Packing
Delivery Time :2-10 work days
Raw material :Fr - 4
Layer count :4 Layer
Board thickness :1.6 mm
Copper thickness :1 Oz / 35 µm
Surface treatment :HASL Lead Free
Solder mask :Green
Board size24.56 * 58.83 mm :303 * 150 mm
Min. Aperture :0.3 mm
Line Trace Width/Space :0.13 / 0.13 mm
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Automated Pprocessing Printed Circuit Board High Frequency Motherboard PCB Board

The green solder mask 4 layers high frequency PCB Board is used in automated processing machine. While the surface treatment of the high frequency PCB is Lead Free HASL. Also, the board size of this PCB Circuit Board is 303 * 150 mm, and the minimum aperture is 0.3 mm.

Fr 4 Material High Frequency PCB Board Automated PCB Assembly 303 * 150 Mm

Why choose LEFANG?

Fr 4 Material High Frequency PCB Board Automated PCB Assembly 303 * 150 Mm

-- Lefang provides One-Stop solution to save your cost and time.

Quick Quotation - Competitive factory price is always offered
Free Sample - Sample for free before mass production
Quality Control - Sales Team monitors the production quality and lead time
On Time Delivery - Customize the logistics plan according to customer’s requirement

After-sale Service - Reply to the claim within 24 hours to make sure our customer’s manufacturing

How to get quick quotation?

Fr 4 Material High Frequency PCB Board Automated PCB Assembly 303 * 150 Mm

Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc
Step 2 Also please provide us the below details for quick quotation:

Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

Material brand: SY / KB / Rogers (optional)
Material Specification:High Tg / copper based / aluminum based or others (optional)
Board thickness: 0.1 - 6.0 mm
Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )
Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin
Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc
Board size and quantity

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

SAMPLE:

Board Basic Info - SAMPLE

Board material

Fr - 4

Material brand

KB

Material Specification

Tg 170

Board thickness

1.6 mm

Copper thickness

1 Oz

Surface Treatment

ENIG

Solder mask / sSilk print

Green / White

Board size

100 mm * 100 mm

Quantity

10k

Lead Time
Fr 4 Material High Frequency PCB Board Automated PCB Assembly 303 * 150 Mm
Layer count Sample lead time/workday Batch lead time/workday
1-2L 2 6
4L 5 8
6L 5 9
8L 6 10
10L 8 10
12L 8 12
14L 10 15
16L 10 18
18-40L (Up to difficulty) at least 18 at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

How to guarantee our high quality products?
Fr 4 Material High Frequency PCB Board Automated PCB Assembly 303 * 150 Mm

-- We employ 70 professional engineers to ensure our high quality products.

Department Headcount
Electronic Eng. 13
R&D Eng. 15
PE Eng. 10
CAM Eng. 26
MI Eng. 6


Now send us your inquiry, and you will be replied within 8 hours!

Little knowledge - Multilayer PCB Board

Multilayer printed circuit boards (Multilayer PCBs) represented the next major evolution in fabrication technology.

A very sophisticated and complex methodology came from the base platform of double sided plated.

This methodology would again allow circuit board designers a dynamic range of interconnects and applications.

Multilayer PCB board were essential in the advancement of modern computing, and their basic construction and fabrication are similar to micro chip fabrication on a micro size.

The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills, and it can be built on ceramic, copper, and aluminum. Also, blind and buried vias are commonly produced in multilayer pcb manufacturing, along with pad on via technology.

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