Shenzhen Lefang Electronics Co., Ltd

PCB Circuit Boards OEM ODM MAKE YOUR PRODUCT BETTER 18 Years Professional PCB Circuit Boards Supplier

Manufacturer from China
Active Member
8 Years
Home / Products / Heavy Copper PCB /

1.6mm 6 Layers Fr4 ENIG 4 Oz Copper PCB , High Density Interconnect PCB Board

Contact Now
Shenzhen Lefang Electronics Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissCyan Hong
Contact Now

1.6mm 6 Layers Fr4 ENIG 4 Oz Copper PCB , High Density Interconnect PCB Board

Ask Latest Price
Video Channel
Brand Name :LEFANG
Model Number :OT6006L359
Certification :ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Place of Origin :Shenzhen,China
MOQ :1 Piece
Price :Negotiable
Payment Terms :T/T, Western Union, Paypal
Supply Ability :290, 000sqm Per Month
Delivery Time :2-10 work days
Packaging Details :Inner: Vacuum Packing; Dry Packing out Packing
Base Material/ Dielectric :fr - 4
Layer :6 Layers
Surface treatment :Immersion gold
Board thickness :1.6mm
Solder Mask :Green
Min. Aperture :0.15mm
Line Width/Spacing :0.15 / 0.15 mm
Size :45 * 12 mm
Copper Thickness :140 µm / 4 oz
more
Contact Now

Add to Cart

Find Similar Videos
View Product Description

1.6mm 6 Layers Fr4 ENIG 4 OZ Heavy Copper PCB Printed Circuit Board

The copper thickness of the PCB is 4 OZ / 140 µm, which enables the board to conduct a higher current than the tradition rigid printed circuit board. While the board thickness of thick copper board is 1.6 mm, with immersion gold surface treatment and green solder mask.

1.6mm 6 Layers Fr4 ENIG 4 Oz Copper PCB , High Density Interconnect PCB Board

How to get quick quotation?

1.6mm 6 Layers Fr4 ENIG 4 Oz Copper PCB , High Density Interconnect PCB Board

Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc
Step 2 Also please provide us the below details for quick quotation:

Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

Material brand: SY / KB / Rogers (optional)
Material Specification:High Tg / copper based / aluminum based or others (optional)
Board thickness: 0.1 - 6.0 mm
Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )
Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin
Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc
Board size and quantity

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

SAMPLE:

Board Basic Info - SAMPLE

Board material

Fr - 4

Material brand

KB

Material Specification

Tg 170

Board thickness

1.6 mm

Copper thickness

1 Oz

Surface Treatment

ENIG

Solder mask / sSilk print

Green / White

Board size

100 mm * 100 mm

Quantity

10k

Technical Data
1.6mm 6 Layers Fr4 ENIG 4 Oz Copper PCB , High Density Interconnect PCB Board
Item Details
Max layer count 20 L
Max board thickness 6.0 mm
Max aspect ratio 10 : 1
Max copper thickness 6 OZ
Max dimension 600 * 700mm
Min thickness of 4 layers PCB 0.4 mm
Min hole / pad 0.15 / 0.35mm
Hole location accuracy + / - 0.05mm
PTH hole tolerance + / - 0.05mm
Min line width and line space 0.065 / 0.065mm
Surface treatment

HASL / HASL lead free, OSP

Immersion gold/silver/tin, gold plating (hard gold and soft gold),

silver plating, tin plating, platinum plating, carbon ink,

ENEPIG

(electroless nickel - electroless palladium - immersion gold)

Lead Time

1.6mm 6 Layers Fr4 ENIG 4 Oz Copper PCB , High Density Interconnect PCB Board
Layer count Sample lead time/workday Batch lead time/workday
1-2L 2 6
4L 5 8
6L 5 9
8L 6 10
10L 8 10
12L 8 12
14L 10 15
16L 10 18
18-40L (Up to difficulty) at least 18 at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays


What kinds of quality Raw Materials will be used?
1.6mm 6 Layers Fr4 ENIG 4 Oz Copper PCB , High Density Interconnect PCB Board

Board Brand ITEQ, SY, Isola. Rogers, Arlon, Nelco, Taconic, Hitachi, KB,etc
Potion Rohm & Haas, Atotech, Umicore
Printing Ink Taiyo, Rongda
Dry Film Asahi, Dupont, Etertec


Now send us your inquiry, and you will be replied within 8 hours!

Little knowledge - High Tg PCB
The glass transition temperature (Tg) is an important normative dimension for the base material that determines the temperature at which the resin matrix converts from a glassy, brittle condition into a soft, elastic one.
Normally high Tg refers to high heat resistance in PCB raw material.
The standard Tg for copper clad laminate is between 130 – 140℃. High Tg is generally greater than 170℃, and middle Tg is generally greater than 150℃. Basically the printed circuit board with Tg≥170℃, we call high Tg PCB.
The higher of TG value, the better of pcb high temperature resistance.

Inquiry Cart 0