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6 Layers FR4 Medical Equipment PCB Double Sided with OSP Surface Finish

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Shenzhen Lefang Electronics Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MissCyan Hong
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6 Layers FR4 Medical Equipment PCB Double Sided with OSP Surface Finish

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Brand Name :LEFANG
Model Number :RM0006L379
Certification :ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Place of Origin :Shenzhen,China
MOQ :1 Piece
Price :Negotiable
Payment Terms :T/T, Western Union, Paypal
Supply Ability :290, 000sqm Per Month
Delivery Time :2-10 work days
Packaging Details :Inner: Vacuum Packing; Dry Packing out Packing
Base Material/ Dielectric :FR - 4
Layer :6 Layers
surface treatment :OSP
Copper Thickness :1 OZ
Solder Mask :Green
Min. Aperture :0.1 mm
Line Width/Spacing :1.0 / 1.0 mm
Size :64 * 39 mm
Board thickness :1.6 mm
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6 Layers FR4 Medical Equipment PCB Double Sided with OSP Surface Finish

The 6 layers double-sided PCB is made FR4 raw material with finish board thickness of 1.6 mm, which is applied to medical equipments. The total specification of the medical equipment PCB is 79 * 30 mm, while the minimum aperture, line trace and space are 0.1 mm.

6 Layers FR4 Medical Equipment PCB Double Sided with OSP Surface Finish

How to get quick quotation?

Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc
Step 2 Also please provide us the below details for quick quotation:

Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

Material brand: SY / KB / Rogers (optional)
Material Specification:High Tg / copper based / aluminum based or others (optional)
Board thickness: 0.1 - 6.0 mm
Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )
Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin
Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc
Board size and quantity

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

SAMPLE:

Board Basic Info - SAMPLE

Board material

Fr - 4

Material brand

KB

Material Specification

Tg 170

Board thickness

1.6 mm

Copper thickness

1 Oz

Surface Treatment

ENIG

Solder mask / sSilk print

Green / White

Board size

100 mm * 100 mm

Quantity

10k

Technical Data
Item Details
Max layer count 20 L
Max board thickness 6.0 mm
Max aspect ratio 10 : 1
Max copper thickness 6 OZ
Max dimension 600 * 700mm
Min thickness of 4 layers PCB 0.4 mm
Min hole / pad 0.15 / 0.35mm
Hole location accuracy + / - 0.05mm
PTH hole tolerance + / - 0.05mm
Min line width and line space 0.065 / 0.065mm
Surface treatment

HASL / HASL lead free, OSP

Immersion gold/silver/tin, gold plating (hard gold and soft gold),

silver plating, tin plating, platinum plating, carbon ink,

ENEPIG

(electroless nickel - electroless palladium - immersion gold)

Lead Time
Layer count Sample lead time/workday Batch lead time/workday
1-2L 2 6
4L 5 8
6L 5 9
8L 6 10
10L 8 10
12L 8 12
14L 10 15
16L 10 18
18-40L (Up to difficulty) at least 18 at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

What kinds of test function will be offered?

AOI (Automated Optical Inspection) Impedance control
Automatic short-circuit testing Metallographic microscope
RoHS detector Fly probe/ fixture mold
Dielectric tester Visual inspection


Now send us your inquiry, and you will be replied within 8 hours!

Little knowledge - Multilayer PCB Board
Multilayer printed circuit boards (Multilayer PCBs) represented the next major evolution in fabrication technology.
A very sophisticated and complex methodology came from the base platform of double sided plated.
This methodology would again allow circuit board designers a dynamic range of interconnects and applications.
Multilayer PCB board were essential in the advancement of modern computing, and their basic construction and fabrication are similar to micro chip fabrication on a micro size.
The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills, and it can be built on ceramic, copper, and aluminum. Also, blind and buried vias are commonly produced in multilayer pcb manufacturing, along with pad on via technology.

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